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 AOD404 N-Channel Enhancement Mode Field Effect Transistor
General Description
The AOD404 uses advanced trench technology to provide excellent RDS(ON), low gate chargeand low gate resistance. This device is ideally suited for use as a high side switch in CPU core power conversion. Standard Product AOD404 is Pb-free (meets ROHS & Sony 259 specifications). AOD404L is a Green Product ordering option. AOD404 and AOD404L are electrically identical.
TO-252 D-PAK D Top View Drain Connected to Tab G S G D S
Features
VDS (V) = 30V ID = 85A (VGS = 10V) RDS(ON) < 7m (VGS = 10V) RDS(ON) < 8m (VGS = 4.5V)
Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage Continuous Drain Current B,G Pulsed Drain Current Avalanche Current C Repetitive avalanche energy L=0.1mH TC=25C Power Dissipation B Power Dissipation
A C
Maximum 30 12 85 65 200 30 120 100 50 2.5 1.6 -55 to 175
Units V V A A mJ W W C
TC=25C
G
TC=100C B
ID IDM IAR EAR PD PDSM TJ, TSTG
TC=100C TA=25C TA=70C
Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A A Maximum Junction-to-Ambient C Maximum Junction-to-Case
Symbol t 10s Steady-State Steady-State RJA RJL
Typ 14.2 39 0.8
Max 20 50 1.5
Units C/W C/W C/W
Alpha & Omega Semiconductor, Ltd.
AOD404
Electrical Characteristics (TJ=25C unless otherwise noted) Parameter Symbol STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS IGSS VGS(th) ID(ON) RDS(ON) gFS VSD IS Zero Gate Voltage Drain Current Gate-Body leakage current Gate Threshold Voltage On state drain current Static Drain-Source On-Resistance VGS=4.5V, ID=20A Forward Transconductance VDS=5V, ID=20A Diode Forward Voltage IS=1A,VGS=0V Maximum Body-Diode Continuous Current Conditions ID=250A, VGS=0V VDS=24V, VGS=0V TJ=55C VDS=0V, VGS= 12V VDS=VGS ID=250A VGS=10V, VDS=5V VGS=10V, ID=20A TJ=125C 1 85 5.4 8.4 6.6 90 0.74 1 85 2100 VGS=0V, VDS=15V, f=1MHz VGS=0V, VDS=0V, f=1MHz 536 165 0.95 19.7 VGS=4.5V, VDS=15V, ID=20A 3.6 7.9 5.9 VGS=10V, VDS=15V, RL=0.75, RGEN=3 IF=20A, dI/dt=100A/s 11 36.2 12 35 33 10 17 55 18 42 50 1.2 24 2520 7 10.5 8 1.6 Min 30 0.002 1 5 100 2 Typ Max Units V A nA V A m m S V A pF pF pF nC nC nC ns ns ns ns ns nC
DYNAMIC PARAMETERS Ciss Input Capacitance Coss Crss Rg Output Capacitance Reverse Transfer Capacitance Gate resistance
SWITCHING PARAMETERS Qg(4.5V) Total Gate Charge Qgs Gate Source Charge Qgd tD(on) tr tD(off) tf trr Qrr Gate Drain Charge Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=20A, dI/dt=100A/s
A: The value of R JA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25C. The Power dissipation P DSM is based on steady-state R JA and the maximum allowed junction temperature of 150C. The value in any given application depends on the user's specific board design, and the maximum temperature of 175C may be used if the PCB or heatsink allows it. B. The power dissipation P D is based on T J(MAX)=175C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. C: Repetitive rating, pulse width limited by junction temperature T J(MAX)=175C. D. The R JA is the sum of the thermal impedence from junction to case R JC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. F. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25C. The SOA curve provides a single pulse rating. G. The maximum current rating is limited by the package current capability. Rev5: August 2005 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
AOD404
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60 50 40 ID (A) 30 20 10 0 0 1 2 3 4 VDS (Volts) Fig 1: On-Region Characteristics 5 VGS=2.5V 10V 3.5V 3V 40 ID(A) 30 20 10 0 1 2 2.5 3 VGS(Volts) Figure 2: Transfer Characteristics 1.5 3.5 125C 25C 60 50 VDS=5V
7.5 7 RDS(ON) (m) 6.5 6 5.5 5 4.5 0 10 20 30 40 50 60 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 20 VGS=10V
1.8 Normalized On-Resistance 1.6 1.4 VGS=4.5V 1.2 1 ID=20A VGS=10V
VGS=4.5V
0.8 0 25 50 75 100 125 150 175 Temperature (C) Figure 4: On-Resistance vs. Junction Temperature 1.0E+02 1.0E+01 125C
16 RDS(ON) (m)
ID=20A
1.0E+00 IS (A) 1.0E-01 1.0E-02 1.0E-03 1.0E-04 1.0E-05 25C
12
125C
8
25C
4 2 4 6 8 10 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage
0.0
0.6 0.8 1.0 VSD (Volts) Figure 6: Body-Diode Characteristics
0.2
0.4
1.2
Alpha & Omega Semiconductor, Ltd.
AOD404
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5 4 VGS (Volts) 3 2 1 0 0 5 10 15 20 25 Qg (nC) Figure 7: Gate-Charge Characteristics VDS=15V ID=20A Capacitance (pF) 3500 3000 2500 2000 1500 1000 500 0 0 15 20 25 VDS (Volts) Figure 8: Capacitance Characteristics 5 10 30 Crss Coss Ciss
1000 RDS(ON) limited 1ms 10ms 0.1s 1s T J(Max)=150C T A=25C 10s DC 10s 100s Power (W)
100 80 60 40 20 0 0.01
100 ID (Amps)
T J(Max)=150C T A=25C
10
1
0.1 0.1 1 10 100 VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F)
0.1
1
10
100
1000
Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
10 ZJA Normalized Transient Thermal Resistance
1
D=T on/T T J,PK =T A+PDM.ZJA.RJA RJA=50C/W
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1 PD 0.01 Single Pulse T on T
0.001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Alpha & Omega Semiconductor, Ltd.
AOD404
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
120 ID(A), Peak Avalanche Current Power Dissipation (W) 0.001 0.01 100 80 60 40 20 0 0.00001 T A=25C 120 100 80 60 40 20 0 0.0001 0 25 50 75 100 125 150 175 TCASE (C) Figure 13: Power De-rating (Note B)
tA =
L ID BV - VDD
Time in avalanche, t A (s) Figure 12: Single Pulse Avalanche capability
100 80 60 40 20 0 0 25 50 75 100 125 150 175 TCASE (C) Figure 14: Current De-rating (Note B)
Alpha & Omega Semiconductor, Ltd.
Current rating ID(A)


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